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What are the factors that cause SMT chip components to shift?
During SMT surface mount production and processing, component displacement after placement is frequently encountered. This is actually a common defect in SMT processing plants. With the rapid development of technology and improvement of living standards, the requirements for electronic products are becoming increasingly smaller and more precise. Traditional DIP plug-in components in SMT production are no longer as effective as SMT surface mount components on smaller, denser PCBA boards, especially for large-scale, highly integrated ICs. Some problems also frequently occur in SMT surface mount, such as component displacement. So what causes component displacement in surface mount processing?
During SMT surface mount production and processing, component displacement after placement is frequently encountered. This is a common defect in SMT factories. With the rapid development of technology and improvement of living standards, the requirements for electronic products are becoming increasingly smaller and more precise. Traditional DIP plug-in components in SMT production are less effective than SMT surface mount components on smaller, denser PCBA boards, especially for large-scale, highly integrated ICs. Some problems also frequently occur in SMT surface mount, such as component displacement. So, what causes component displacement in surface mount processing?
What causes component displacement in SMT production?
1. The air pressure of the placement machine nozzle is not adjusted in time, and low pressure can cause component displacement.
2. The flux content is too high, and excessive flux flow during the reflow soldering process can cause component displacement.
3. The solder paste is not viscous enough, and component oscillation or shaking during movement causes component displacement.
4. Solder paste is used beyond its usable time, causing flux degradation and resulting in poor surface mount soldering.
5. Component displacement during movement after SMT printing and placement due to oscillation or incorrect transfer methods.
6. Placement machine mechanical problems cause incorrect placement of components.
By carefully performing each step of SMT processing production and strictly following the process operation, Tongsen Electronic's service attitude will bring you high-quality and reliable products.
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