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Testing equipment used in PCBA processing with materials and labor
PCBA turnkey production involves multiple quality inspection stages distributed across various workstations throughout the production process, playing a crucial role in ensuring product quality. Below, Guangzhou PCBA processing factory Tongsen Electronic provides a brief introduction to some common quality inspection equipment, such as SPI solder paste inspection machines, AOI automatic optical inspection machines, and X-ray inspection machines.
I. SPI Solder Paste Inspection Machine
Solder paste printing is a front-end process in SMT surface mount technology. The quality of solder paste printing directly impacts the quality of PCBA processing. Most processing defects in SMT originate from poor solder paste printing. The main function of the SPI solder paste inspection machine is to detect parameters such as the amount, height, area, and flatness of the solder paste. It can also detect problems such as solder paste offset, bridging, and defects.
II. AOI Automatic Optical Inspection Machine
The AOI automatic optical inspection machine is a crucial inspection tool and process quality control tool in the electronics manufacturing industry to ensure PCBA processing quality. In PCBA turnkey production, AOI optical inspection equipment uses high-definition cameras to capture circuit board images, comparing them to parameters of qualified samples pre-entered into the system to verify whether the SMT surface mount production quality meets requirements. AOI inspection equipment can be placed after solder paste printing, before reflow soldering, after reflow soldering, and other locations. It can effectively identify solder paste printing problems, missing components, misplaced components, component offset, cold solder joints, and solder cracks.
III. X-RAY Inspection Machine
X-ray inspection uses low-energy X-rays to penetrate the PCBA without damaging the product to detect the quality of solder joints at relevant locations. For example, the solder joints of BGA and QFN components are located under the components. It is difficult to directly detect whether the solder joint quality is defective or whether there is internal damage to the components using conventional equipment and visual inspection.
Guangzhou Tongsen Electronic Technology Co., Ltd. provides professional one-stop Guangzhou electronic product processing, SMT surface mount processing, electronic OEM processing, PCBA turnkey, and PCBA processing services.
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