Welcome to Guangzhou Tongsen Electronic Technology Co., LTD. Website!
SMT Process: Every Complex Detail You Must Know
SMT, or surface mount technology, is a modern form of PCB (printed circuit board) used in various electromechanical devices. In this technology, all components and necessary elements are mounted directly onto the surface of the circuit board.
What is SMT?
SMT, or Surface Mount Technology, is a modern form of PCB (Printed Circuit Board) used in various electromechanical devices. In this technology, all components and necessary elements are mounted directly onto the surface of the circuit board.
Therefore, there is no need to embed components into the board using wires or drilling holes. This technology is mainly used as a replacement for through-hole technology. With SMT processes in modern devices, automated production of different components can be achieved. Therefore, devices containing the required assembled parts can be manufactured.
Furthermore, Surface Mount Technology is known for providing high output for devices by eliminating bottlenecks on the assembly line.
What is the SMT process flow?
The SMT process is related to the production of surface mount technology. It consists of the following basic steps:
● Material Preparation and Review
One step of the SMT process is related to the production of SMC and PCB materials. You must check for defects in the materials. In addition, check the copper pads with holes. These pads are commonly known as pads.
● Stencil Preparation
Ensure that high-quality stencils are prepared. They provide a fixed position for solder paste printing to design the pads.
● Solder Paste Printing
Try to use a mixture of flux and tin to prepare the solder paste. High-quality solder paste will combine the SMC and pads on the printed circuit board.
● Placement of SMC
After the solder paste is ready, use a pick-and-place machine to place all SMC components on the board.
● Perform Soldering Reflow
After placing the SMC components, the board will enter the reflow oven. Here, the board is introduced to the preheating zone, soaking zone, and reflow zone. The main reason for this step is to avoid any joint defects during soldering.
● Clean and Inspect the Board
Inspect the board. All flaws are checked in this step.
What is the function of SMT?
The main function of SMT is to create customized electronic circuits in various electrical and mechanical devices. It performs this function by individually mounting different components onto a printed circuit board. Therefore, by using surface mount technology, industries can produce customized machines without spending a lot of time installing components onto the board in a personalized manner. Another function of SMT is to replace the traditional through-hole mounting system of printed circuit boards. Previously, electronic components on PCBs had to have their leads pass through the board to function properly.
Where is SMT used?
Some commonly used SMT devices are as follows:
USB flash drives;
Smartphones;
Marine equipment;
Navigation systems;
Medical and healthcare fields;
Pacemakers;
Magnetic Resonance Imaging;
The main purpose of SMT in all these devices is to mount different electronic and SMD components on the circuit board.
What are the advantages and disadvantages of the SMT process?
The advantages of the SMT process are as follows:
The process allows complex boards to be integrated with many specialized parts.
You can place components on both sides of the board.
It helps to improve the utility of the board per square inch.
The process helps in the production of fully automated pick-and-place systems.
Supports mass production of precision printed board circuits.
In addition, the SMT process also reduces the manufacturing costs of various devices.
However, the SMT process also has some disadvantages:
The boards are easily cracked due to slight damage.
Once damaged, the components are easily dropped.
Visual inspection of the board is not easy.
A large investment is required due to the use of SMT machines.
Production requires high training and learning costs.
What is the difference between SMT and SMD?
Some of the main differences between SMT and SMD are as follows:
SMT is a technological process used in manufacturing technology, while SMD is a technological device.
SMT places all components on the circuit board through electronic soldering.
Compared to SMT, SMD is a device that integrates all components on the board.
In addition, compared to SMT, SMD improves the productivity and functionality of the device.
SMT Design Considerations
The following section explains the basic considerations for SMT design:
It must match the coefficient of thermal expansion (CTE) of the PWB and the circuit mounting components.
In addition, the soldering surface of SMT cannot be gold-plated, as this will lead to catastrophic joint failures.
When selecting the material surface, solderability must be considered, as it contributes to a better fusion process.
Select circuit components that can withstand the various soldering temperatures in the SMT process.
The dimensions of the PWB should not be less than the requirements during design.
RECOMMENDED NEWS
High-end Custom Services: SMT Chip Processing Meets Diverse Industry Needs
(Telephone contact)
Email:
Address： Room 502, Building 1, No. 13, Bohua 4th Road, Huangpu District, Guangzhou City
COPYRIGHT © 2025 Guangzhou Tongsen Electronic Technology Co., Ltd. All rights reserved.