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How should future PCBs develop to meet the requirements of the next generation of IT?
As a professional PCB manufacturer, we are ready to adopt new technologies and achieve technological innovation to produce more reliable and longer-lasting PCB boards. To date, you can obtain advanced PCBs, including flexible PCBs, rigid-flex PCBs, high-frequency PCBs, and high-Tg PCBs. Competitive pricing on advanced PCBs is your shortcut to obtaining advanced products.
IT is short for information technology, which is a general term referring to all technologies used in the management and processing of information. PCBs (printed circuit boards) are responsible for implementing all functions within the scope of IT, including information generation, processing, transmission, and application. The next generation of IT will develop in several directions: new public telecommunication networks, triple-play convergence, the Internet of Things, new flat-panel displays, high-performance ICs, and cloud computing. To meet the requirements of the next generation of IT, the demands and upgrades for PCBs are naturally becoming increasingly higher.
Essentially, the next generation of IT has put forward four "high" requirements to adapt to its higher demands: high density, high speed/frequency, high thermal conductivity, and high performance. These will all help electronic products serving IT to have high reliability and long lifespan.
High-Density PCB
The integration level (IC linewidth) of high-performance ICs will be calculated in nanometers, while the performance and progress of PCBs must be measured in micrometers. Currently, IC integration is ahead of PCB density. As is well known, PCBs play a supporting role for components (such as ICs), and high-performance ICs require high-performance PCBs for support. Therefore, reducing linewidth is a direction that PCBs urgently need to improve. Currently, the minimum linewidth and spacing of HDI (high-density interconnect) PCBs produced by PCBCart is 2.5mil, which basically meets the needs of general electronic products, but there is still a large gap from the high-density level.
For PCBs to reach the micrometer level, efforts are needed in both materials and process technology. In terms of substrate materials, ultra-thin copper foil needs to be used, which is more expensive and has a complex process. Therefore, copper foil thinning technology for substrate materials is the main direction of development.
High-Speed/High-Frequency PCB
The next generation of information technology will develop based on 5G technology, and the data transmission rate of 5G can reach 52G, which requires high integrity and low distortion of the signal during transmission in the PCB. In addition, the PCB should have a relatively low dielectric constant and dielectric loss. However, epoxy resin-based substrates are difficult to meet this requirement. Therefore, other types of resin-based substrates should be selected. In addition, the linewidth, vias, and pads should be sufficiently low, with low tolerances and manufacturing optimization.
High Thermal Conductivity PCB
Due to the fast signal transmission speed or high frequency, the resistance and dielectric loss will inevitably increase, leading to some defects in line manufacturing. These defects will bring more heat, causing a significant temperature rise inside the PCB. Exceeding 100℃ is also normal, so heat resistance and thermal conductivity have become core issues in PCB manufacturing.
To solve the temperature rise problem, appropriate substrate materials need to be selected, which should have high Tg, high thermal decomposition temperature (Td), and low CTE (coefficient of thermal expansion), and substrate materials with high thermal conductivity need to be used to cope with different situations.
High-Performance PCB
The high performance of PCBs refers to their higher reliability and longer lifespan. The development of IT is inseparable from PCBs, so PCBs not only need to have high density, signal transmission integrity, and high thermal conductivity, but also low CTE, high Tg, etc. Therefore, high-performance PCBs can provide reliability and lifespan guarantees for next-generation IT equipment.
Future Trend: Printed Light Boards
In recent years, the rapid development of technologies such as quantum communication, quantum computers, and quantum chips has provided ample possibilities for the emergence of printed light boards (PLBs). The emergence of PLBs may become a new trend in PCB development.
As a professional PCB manufacturer, be prepared to adopt new technologies and create more reliable and longer-lasting PCBs through technological innovation. To date, you can obtain advanced PCBs, including flexible PCBs, rigid-flex PCBs, high-frequency PCBs, and high-Tg PCBs. Advanced PCB pricing is your shortcut to obtaining advanced products.
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