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Features of SMT processing, explained by a PCBA contract manufacturer
PCBA manufacturers believe that SMT (Surface Mount Technology) is a popular technology and process in the electronics assembly industry. SMT processing mainly refers to the process of pasting components onto a PCB with adhesive or solder paste using a pasting machine, and then passing them through a reflow oven. SMT processing has been recognized by manufacturers for its advantages such as high assembly density, small size of electronic products, and good high-frequency characteristics. Because the SMT pick-and-place machine's work efficiency and stable performance bring great advantages to our production, with the SMT pick-and-place machine, we can greatly improve production efficiency and provide customers with high-quality products.
PCBA contract manufacturers consider SMT (Surface Mount Technology) a prevalent technology and process in the electronics assembly industry. SMT processing primarily involves adhering components to a PCB printed with adhesive or solder paste using a placement machine, followed by a reflow oven. SMT processing is recognized by manufacturers for its high assembly density, small product size, and excellent high-frequency characteristics. The high efficiency and stable performance of SMT pick-and-place machines offer significant advantages to our production, greatly improving efficiency and providing customers with high-quality products.
1. PCBA contract manufacturers believe that insufficient vacuum pressure in the SMT pick-and-place machine's nozzle, or the automatic switching of the mechanical valve on the placement head from air blowing to vacuum suction before picking up components during the mounting process, can create a certain negative pressure. After the component is sucked, the machine operates normally when the negative pressure sensor's detection value is within a certain range; otherwise, the suction is poor. One aspect is the release of pressure in the air source circuit, such as aging and cracking of rubber air hoses, aging and wear of seals, and nozzle wear after prolonged use. Another aspect is the dust in the external environment of the Shenzhen pick-and-place machine, especially the large amount of waste generated after cutting the paper braids and tape-packaged components, leading to nozzle blockage.
2. PCBA contract manufacturers believe that incorrect pick-and-place machine program settings can also reduce mounting efficiency. The solution is for pick-and-place machine manufacturers to increase customer training, allowing customers to get started faster. This improves the proficiency and accuracy of technical personnel in SMT chip processing plants.
3. PCBA contract manufacturers believe that the quality of electronic components affects the pick-and-place process; the nozzle picks up electronic components for mounting, and the pins may not be fully seated or may be bent or broken. In this case, only the quality of the purchased mounting components can be controlled. This not only affects mounting efficiency and product quality but also causes varying degrees of damage to the nozzle when it frequently picks up and mounts such components, reducing the nozzle's service life over time. Therefore, regular maintenance of machinery and equipment is a crucial aspect of SMT chip processing.
PCBA contract manufacturers believe that mutual trust is a prerequisite for choosing business cooperation. Establishing and maintaining trust requires a long period of development. Long-term cooperation is a suitable business model. A qualified SMD processing plant has complete industry qualifications and a professional engineering procurement team. We can guarantee the delivery time of customer products, saving customers time and effort.
The above is about some knowledge points about SMT processing. We hope that everyone can carefully learn and understand the relevant knowledge, choose products and equipment that meet their needs, and ensure their own efficiency. If you want to learn more details, please contact us.
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