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Some knowledge points about PCBA OEM and material supply, PCBA OEM and material supply manufacturers tell you
PCBA contract manufacturers believe that process control is an indispensable part of PCBA contract manufacturing. It involves various processes such as solder paste management, chip bonding, and component loss, etc.
PCBA contract manufacturers believe that process control is an indispensable part of PCBA contract manufacturing. It involves various processes, such as solder paste management, chip bonding, and component loss. It also standardizes control over process parameters, procedures, personnel, equipment, materials, processing and testing, and workshop environment. These operating and processing methods are very helpful in improving the overall quality of SMT chip processing and PCBA processing. During the processing control, we can promptly identify and screen out defective products and remove them from the production line, preventing substandard products from entering the next processing stage. A professional processing plant should strictly control product quality and prioritize quality management.
PCBA contract manufacturers believe that high-temperature molten solder has strong permeability, but not all solderable metals (PCB boards and components) are permeable. For example, aluminum usually forms a dense protective layer on its surface, and different internal molecular structures make it difficult for other molecules to penetrate. Secondly, if there is an oxide layer on the surface of the solderable metal, it will also prevent molecular penetration. We usually use flux or gauze to wipe it.
PCBA contract manufacturers believe that flux is also an important factor affecting poor solderability in PCBA contract manufacturing. The main function of flux is to clean oxides from the PCB and components and prevent re-oxidation during soldering. Improper selection, uneven coating, and insufficient flux can all lead to poor solderability. Well-known brand fluxes can be selected, offering high activation and penetration effects and effectively removing refractory oxides; check the solder nozzle. Damaged nozzles should be replaced promptly to ensure that the PCB surface is coated with an appropriate amount of flux to fully utilize the soldering effect of the flux.
PCBA contract manufacturers believe that poor solder penetration in PCBA is directly related to the wave soldering process. The parameters of poor solderability, such as wave height, temperature, soldering time, or moving speed, have been re-optimized. First, the track angle is appropriately reduced, the peak height is increased, and the contact between the solder and the soldering end is improved; then, the temperature of the wave soldering is increased. Generally speaking, the higher the temperature, the stronger the permeability of the solder, but this must consider the resistance temperature of the components; the conveyor belt speed can also be reduced, and the preheating and soldering time can be increased to allow the flux to fully remove oxides, wet the soldering end, and increase solder consumption.
PCBA contract manufacturers believe that in the actual inspection of plug-in soldering quality, a considerable proportion of solder joints only have conical solder on the surface, while there is no solder penetration inside the through-hole. Functional testing confirms that many of these components are poorly soldered, mostly due to inappropriate soldering iron temperature and short soldering time. Poor solderability in PCBA easily leads to poor soldering problems, increasing rework costs. If high solderability is required for PCBA and strict soldering quality is required, selective wave soldering can be used to effectively reduce the problem of poor PCBA solderability.
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