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What is the maximum temperature resistance of the PCB circuit board?
FPC is not only a flexible printed circuit board, but also an important design method for connecting three-dimensional circuit structures. This structure can be combined with other electronic product designs to create a variety of different applications.
To ensure the quality of finished PCB circuit boards, reliability and adaptability tests are necessary during the manufacturing process. The high-temperature test for PCB circuit boards is to prevent undesirable reactions such as board explosion, bubbling, and delamination at excessively high temperatures, which can lead to poor product quality or complete scrap. This is an issue that needs attention. So, what is the temperature resistance of a PCB circuit board, and how is a high-temperature test performed?
The temperature resistance of a PCB circuit board is related to the temperature resistance of its raw materials, solder paste, and surface components. Typically, a PCB circuit board can withstand temperatures as high as 300 degrees for 5-10 seconds; during lead-free wave soldering, the temperature is approximately 260 degrees, and during lead soldering, it is approximately 240 degrees.
PCB Circuit Board High-Temperature Resistance Test:
1. First, prepare the PCB circuit board production board and soldering furnace.
Take 5 pieces of 10*10cm substrates (or laminated boards, finished boards); (copper substrate without bubbling or delamination).
Substrate: 10 cycles or more; Laminated board: LOW CTE 150 10 cycles or more; HTg material 10 cycles or more; Normal material 5 cycles or more.
Finished board: LOW CTE 150 5 cycles or more; HTg material 5 cycles or more; Normal material 3 cycles or more.
2. Set the soldering furnace temperature to 288+/-5 degrees and calibrate using a contact thermometer;
3. First, use a soft brush dipped in flux to apply it to the board surface, then use crucible tongs to pick up the test board and immerse it in the soldering furnace. After 10 seconds, take it out and cool it to room temperature. Visually check for bubbling or board explosion, this is 1 cycle;
4. If bubbling or board explosion is visually observed, immediately stop the soldering and analyze the explosion point f/m. If there is no problem, continue the cycle until the board explodes, with 20 cycles as the endpoint;
5. The bubbling area needs to be sectioned for analysis to understand the source of the explosion point, and take pictures.
PCB circuit boards can experience problems at excessively high temperatures. Therefore, it is necessary to understand the temperature resistance of PCB circuit boards of different materials in detail. Staying below the maximum allowable temperature will prevent PCB circuit board failure and increased costs.
Difference Between PCB and FPC
PCBs generally use FR4 as the substrate, also known as a rigid board, and cannot be bent or flexed; FPCs generally use PI as the substrate, which is a flexible material that can be bent arbitrarily.
FPCs can withstand millions of dynamic bends without damaging the wires. They can be moved and expanded arbitrarily according to spatial layout requirements, achieving three-dimensional assembly and integrated component assembly and wiring, which is unmatched by other types of circuit boards.
FPCs are not only flexible circuit boards but also an important design method for connecting three-dimensional circuit structures. This structure can be combined with other electronic product designs to create various different applications. For example, PCB circuit boards are generally planar. The common spatial expansion scheme is to use slots and interface cards, but FPCs can create similar structures with switches, and the directional design is more flexible. Using a connecting FPC, two rigid boards can be connected to form a parallel circuit system, and it can also be bent at any angle to adapt to different product shapes.
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