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How to achieve efficient material changeover in SMT surface mount technology processing?
In SMT chip processing, due to the small order volume, frequent line changes, material loading, and material changes are inevitable. Therefore, a strict standardized process must be in place to avoid material errors during frequent line and material changes. The following introduces an efficient material change process for SMT chip processing.
In SMT surface mount processing, due to low order volume, frequent line changes, loading, and material changes are inevitable. Therefore, a strict standardized process is required to avoid material errors during frequent line and material changes. The following introduces an efficient material change process for SMT surface mount processing.
Efficient Oil Change Process for SMT Surface Mount Processing
1. Remove the paper feeder and used paper tray.
2. The SMT operator takes materials from the rack according to their workstation.
3. The operator checks the materials taken according to the work order and location table, confirming that the specifications and models are consistent.
4. The operator checks the new and old trays, verifying that the specifications and models of the two trays are exactly the same.
5. The operator checks the material and confirms its consistency with the company's standards.
6. If any abnormality is found in the above checks, the SMT machine operator should be immediately notified for delayed processing.
7. Take a sample from the new tray and place the material on both the new and old trays.
8. Take the newly installed feeder material, paste it on the refueling process record sheet, and fill in relevant data information such as refueling time and operator management.
9. Install the feeder back to the SMT surface mount machine according to the requirements of the SMT surface mount machine workstation; effective supplementary information records must be completed.
10. The operator notifies the engineering quality management personnel to conduct material matching and testing, and material changes and inspections must be carried out.
11. IPQC checks whether the data information can be correctly developed and checks whether the site is correct according to the site number table.
12. The above-mentioned operation checks of the surface mount machine have been completed before the start of production.
The above 12 steps serve as the standard process for the entire material change process. In surface mount processing, this process must be strictly followed, and each step must have an operating instruction manual for each position. This can avoid material errors.
2. Common SMT Component Polarity Identification Methods
Polarity components require special attention in the entire PCBA processing process, because errors in directional components will lead to batch accidents, or even the failure of the entire PCBA board. Therefore, it is very important for engineering and production personnel to understand SMT polarity components.
I. Definition of SMT Polarity Components
Polarity refers to the consistency of the positive and negative poles or the direction of one pin of the component with the positive and negative poles or the direction of one pin on the PCB board. If the direction of the component is inconsistent with that on the PCB, it is called reverse.
II. SMT Polarity Component Identification Methods
1. Resistors have no polarity
2. Capacitors
2.1 Ceramic capacitors have no polarity
2.2 Tantalum capacitors have polarity. PCB and component positive polarity markings: 1) Color band marking; 2) “+” marking; 3) Beveled marking.
2.3 Aluminum electrolytic capacitors have polarity. Component marking: Color band represents the negative pole; PCB marking: Color band or “+” symbol represents the positive pole.
3. Inductors
3.1 Chip inductors and other two-welded end packages have no polarity requirements
3.2 Multi-pin inductors have polarity requirements. Component marking: Dot/“1” represents the polarity point; PCB marking: Dot/circle/“*” represents the polarity point.
4. Light Emitting Diodes
4.1 SMT surface mount LEDs have polarity. Component negative polarity marking: Green represents the negative pole; PCB negative polarity marking: 1) Vertical bar, 2) Color band, 3) Silkscreen corner; 4) Silkscreen “U” frame.
5. Diodes
5.1 SMT surface mount two-terminal diodes have polarity. Component negative polarity marking: 1) Color band marking, 2) Recess marking, 3) Color marking (glass body); PCB negative polarity marking: 1) Vertical bar marking, 2) Color band marking, 3) Silkscreen corner marking, 4) “U” frame marking
6. Integrated Circuits
6.1 SOIC package has polarity. Polarity marking: 1) Band, 2) Symbol, 3) Recess, 4) Bevel
6.2 SOP or QFP package has polarity. Polarity markings include: 1) Recess/notch marking, 2) One point is different from the other two/three points (size/shape).
6.3 QFN package has polarity. Polarity markings include: 1) One point is different from the other two points (size/shape), 2) Bevel marking, 3) Symbol marking (horizontal line/“+” symbol/dot).
7. Ball Grid Array
7.1 Component polarity: Recess/notch marking/dot/circle marking; PCB polarity: Circle/dot/letter “1 or A”/bevel marking. The component polarity point corresponds to the PCB polarity point.
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