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Quality management of PCBA processing flow
In fact, there is much more to PCBA processing and incoming materials than what has been mentioned above. Each point could be elaborated on at great length. This article only discusses the key points of quality control in PCBA custom processing from a macro perspective, hoping to be helpful to practitioners.
The PCBA processing flow involves a series of processes, including PCB board manufacturing, procurement and inspection of incoming PCB components, SMT surface mount processing, DIP plug-in processing, post-soldering processing, program loading, PCBA testing, and aging. The supply chain and manufacturing chain are relatively long, and defects in any link can lead to a large number of unqualified PCBA finished products, resulting in serious consequences. Therefore, quality management of the entire PCBA processing flow is particularly important.
1. PCB Circuit Board Manufacturing
Holding a pre-production meeting after receiving a PCBA processing order is particularly important. The main purpose is to conduct process analysis of the PCB drawings and documents and submit a Design for Manufacturing (DFM) report based on different customer needs. Many small manufacturers do not attach importance to this, which not only easily leads to quality problems due to poor PCB design but also causes a large amount of rework.
2. PCBA Incoming Component Procurement and Inspection
It is necessary to strictly control the procurement channels of components. It is essential to obtain goods from large traders or original manufacturers to avoid using old or counterfeit materials. In addition, a dedicated PCBA incoming inspection position should be established to strictly inspect the following items to ensure that the components are fault-free.
① PCB: Check reflow oven temperature test, whether vias are blocked or leaking, and whether the board surface is bent, etc.
② IC: Check whether the silk screen printing matches the BOM completely and store under constant temperature and humidity.
③ Other commonly used materials: Check silk screen printing, appearance, and power measurement, etc.
3. SMT Mounting Process
Solder paste printing and reflow oven temperature control are the key points of SMT assembly. A laser stencil with higher quality requirements and better processing requirements should be used. According to the requirements of the PCB board, some stencil holes or U-shaped holes need to be added or reduced, and the stencil can be made according to process requirements. The temperature control of the reflow oven is crucial to the wettability of the solder paste and the firmness of the PCBA, and adjustments can be made according to the normal SOP operating guidelines.
In addition, strictly implementing AOI testing can greatly reduce defects caused by human factors.
4. Plug-in Processing
In the plug-in processing process, the design details of the wave soldering mold are key. How to use the mold frame to significantly improve the yield is the process experience that PE engineers need to continuously practice and summarize.
5. Program Loading
In the previous DFM report, it is recommended that customers set some test points on the PCB so that after all the components on the PCB are soldered, the continuity of the PCBA circuit can be tested. If conditions permit, customers can provide the program, and the program can be burned into the main control IC through the machine to more intuitively test various touch actions, thereby verifying the integrity of the entire PCBA function.
6. PCBA Board Testing
For orders with PCBA testing requirements, the main testing contents include ICT (circuit testing), FCT (functional testing), aging testing, temperature and humidity testing, drop testing, etc.
In fact, the knowledge of PCBA processing and PCBA incoming materials is far more than that. Each point above can be elaborated on at great length. This article only elaborates on the key points of PCBA customized processing quality control from a macro perspective, hoping to be helpful to practitioners.
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