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Eight Super Details You Cannot Ignore in SMT Processes
After all the automatic patch processes are completed, there is one last step: random inspection. This step can roughly assess the production pass rate, that is, the quality of our products. Of course, every step during the random inspection must be done carefully, and every detail in the layout cannot be overlooked, so as to ensure the quality of the company's products.
As an electronic processing supplier, it is essential to thoroughly understand all processing procedures within the factory, especially the main SMT processing procedures.
Each production workshop has an SMT processing production line. This production line can be divided into the following parts.
1. Lead-free solder paste printing
In the previous article, I mentioned the printing of lead-free solder paste. In this part, we use an SMT semi-automatic printing machine. In this operation, we need to pay attention to the alignment of the stencil and PCB. The stencil openings and PCB pads must completely overlap. After test printing 3 pieces and confirming OK, normal production can begin. After printing, each PCB must undergo self-inspection. The printed solder paste must not have defects such as excess solder, insufficient solder, solder bridging, or offset. Defective printed products must be carefully cleaned. Clean the stencil in time. Add solder paste in time to ensure the amount of solder paste rolling on the stencil.
2. Material loading
For the machine loading, we use a CP machine, which allows for fast loading. Sufficient preparation is needed before starting the machine, such as material placement and machine positioning. When the machine lights up yellow, it's time to prepare for loading.
3. Large component placement
This step is to help add large components to the PCB that the CP machine cannot place, such as crystals. In this step, we use an XP machine, which can automatically place large components. Note that this process is similar to the CP machine.
4. Pre-reflow QC
This step is an indispensable and important part of the entire SMT process. This step ensures that all semi-finished products are completely free before reflow, hence the name pre-reflow QC. This position usually uses QC to inspect the PCBs flowing from the placement machine to check for missing or misplaced components. Then manually correct any missing or misplaced components.
5. Reflow soldering
The purpose of reflow soldering is to melt the solder paste on the board and firmly solder the materials to the board. The machine required for this process is a wave soldering machine. There are also several points to note about wave soldering: one is the adjustment of the furnace temperature. This requires comprehensive consideration of various factors, such as the heating degree of the PCB board and the heat resistance of the materials, and then setting the temperature of the wave soldering machine. In this way, the PCB board will basically not have other problems after passing through the furnace.
6. Post-reflow QC
Quality is life. Some problems will inevitably occur after reflow, such as open solder joints, cold solder joints, and solder bridging. So how to find these problems? We also need to equip QC in this step to check the board surface for problems after reflow and then manually correct them.
7. QA sampling inspection
After all the automatic placement processes are completed, there is a final step: sampling inspection. This step can roughly evaluate the production pass rate, that is, the quality of our products. Of course, every step during sampling inspection must be done carefully, and no detail on the layout can be overlooked. Only in this way can the quality of the company's products be guaranteed.
8. Warehousing
Final warehousing. Warehousing also needs attention. The packaging must be neat and tidy, and cannot be careless. Only in this way can customers have a perfect experience.
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