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What are the requirements for PCB boards in SMT processing?
SMT processing usually has many requirements for PCBs, and only boards that meet the requirements can be accepted for SMT processing. So, why does the SMT welding process have so many requirements for circuit boards? Next, the SMT manufacturer will give you a detailed introduction.
SMT processing usually has many requirements for PCBs, and only boards that meet the requirements can be accepted for SMT processing. So, why does the SMT soldering process have so many requirements for circuit boards? Next, the SMT manufacturer will give you a detailed introduction.
Practice has proved that a large number of special processes are involved in the processing process, and the application of special processes will bring about SMT processing requirements for PCBs. If there is a problem with the PCB board, it will increase the difficulty of the PCBA soldering process, and may eventually lead to welding defects and unqualified boards. Therefore, in order to ensure the smooth completion of special processes and facilitate SMT processing, the PCB board must meet the manufacturability requirements in terms of size, pad distance, etc.
The following are the requirements of SMT processing for PCBs:
1. PCB Size: The width of the PCB (including the board edge) must be greater than 50mm and less than 460mm, and the length of the PCB (including the board edge) must be greater than 50mm.
2. PCB Edge Width: PCBA board width: 5mm, board spacing: 8mm, pad distance from edge: 5mm.
3. PCB Bending Degree: Upward bending: 1.2mm, Downward bending: 0.5mm, PCB deformation: Larger deformation height ÷ diagonal length 0.25.

4. PCB Board Mark Point: Mark shape: Standard circle, square, triangle; Mark size: 0.8~1.5mm; Mark material: Gold, tin, copper, platinum; Mark surface requirements: Flat, smooth surface, no oxidation, no dirt; Mark surrounding requirements: Within 1mm of the mark position, there should be no obstacles such as green oil with a significantly different color from the mark; More than 3mm from the edge of the board, and no holes or test points within 5mm of the mark.
5. PCB Solder Pad: The surface mount device solder pad has no through-hole. If there is a through-hole, the solder paste will flow into the hole, resulting in less solder in the device, or solder flowing to the other side, resulting in an uneven surface and inability to print solder paste. When designing and producing PCBs, it is necessary to understand some PCB soldering process knowledge so that the product is suitable for production. Understanding the requirements of the processing plant first can make the subsequent manufacturing process smoother and avoid unnecessary trouble.
These are the requirements of SMT processing for PCBs. In production, PCBs are not neglected, producing high-quality and compliant PCBs so that the circuit boards can better accept other special processes, and give life to the PCBs and inject the soul of function.
1. Large board size: 310mm*410mm (SMT);
2. Large board material thickness: 3mm;
3. Small board material thickness: 0.5mm;
4. Small Chip components: 0201 package 0.6mm*0.3mm and above components;
5. Large mounted component weight: 150g;
6. Large component height: 25mm;
7. Large component size: 150mm*150mm;
8. Small pin spacing: 0.3mm;
9. Small ball component (BGA) spacing: 0.3mm;
10. Small ball component (BGA) ball diameter: 0.3mm;
11. High component mounting accuracy (100QFP): 25um@IPC;
12. Mounting capacity: 3 million to 4 million points/day.
Strength Assurance
SMT workshop: Equipped with imported SMT machines and optical inspection equipment, with a daily production capacity of up to 4 million points. QC personnel are equipped in each process to control product quality at all times.

DIP production line:
1. Two wave soldering machines, more than 10 employees with more than 3 years of working experience, high worker proficiency, capable of soldering various plug-in materials.
2. Quality assurance, high cost performance
▪ High-end equipment can mount precision irregular components, BGA, QFN, 0201 materials. Stencil mounting, loose material hand mounting are also available.
▪ Samples and size batch production are available.
3. Rich experience in SMT and soldering of electronic products, stable delivery
▪ Accumulated service to thousands of electronic enterprises, involving various types of vehicle-mounted equipment and industrial control board SMT processing services. Products are frequently exported to Europe and America, and the quality is highly recognized by new and old customers.
SMT processing, timely delivery, normally 3-5 days after materials are complete, small batches can also be expedited on the same day.
4. Strong repair capability, perfect after-sales service
Experienced maintenance engineers can repair various types of poor soldering caused by product defects, ensuring the connectivity of each product PCB board.
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