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The Importance of Standardized BOM in PCBA Processing
BOM stands for Bill of Materials. Before PCBA processing, customers are required to provide a new BOM. The BOM includes all electronic components and other materials needed to produce the product. The PCBA processing manufacturer needs to purchase materials based on this BOM for production. At the same time, the finance department will also use the BOM to calculate the production cost, and the manufacturing department will also use the BOM as an important basis for production. Therefore, a standardized BOM is very important.
Every time electronic products are manufactured and processed by an SMT factory, the factory will require customers to provide a BOM. Now, it is basically required that the BOM be standardized and complete.
BOM refers to the Bill of Materials. Before PCBA processing, customers are required to provide a new BOM, which includes all the electronic components and other materials needed to produce this product. The PCBA processing factory needs to purchase materials based on this BOM for customer production, and the finance department will also use the BOM to calculate the production cost. The manufacturing department will also use the BOM as an important basis for production, so a standardized BOM is very important.
A standardized BOM should include material code, material name, material specifications, quantity, unit, etc., so that the specifications and quantity of each material can be clearly and intuitively seen.
Many BOMs provided by domestic electronic engineers lack precise definitions of material brands and manufacturer codes, or manufacturer codes lack some suffixes, leading PCBA processing factories to default to conventional series materials. In many cases, different suffixes of IC series may represent subtle differences in application range, packaging method, rated voltage and current, packaging, etc. Such a non-standard BOM may cause the manufactured PCBA board to experience some functional failures or malfunctions in specific application environments, making it extremely difficult to troubleshoot. Therefore, it is strongly recommended that electronic engineers standardize the brand, manufacturer code, product name description, packaging, etc. of each material. This is very important.
Because the research and development and production of electronic products are iterative and updated, the products will be continuously upgraded and optimized. During this process, the BOM will also be updated accordingly. Even material changes will have an immeasurable impact on the product. Therefore, after each update, the old BOM must be marked as an expired file and archived and discontinued. To ensure the orderly management of version numbers, the release and online use of product BOMs must be released by the R&D department, and at least signed and confirmed by R&D engineers and R&D department managers at all levels to ensure the correctness of the BOM. Then, contact the PCBA manufacturer in time to provide the new BOM to the PCBA manufacturer to avoid the situation where the BOM is updated, but the product is still purchased and produced according to the old BOM.
Therefore, a standardized BOM is very important for material procurement, PCBA production, ERP system entry, and financial cost accounting.
What is preheating before PCBA soldering?
The importance of temperature profiles in mass production PCBA processing and soldering environments is widely understood. Slow heating and preheating help activate the flux, prevent thermal shock, and improve solder joint quality during the SMT mounting process. However, when it comes to rework, prototyping, or PCBA first-article projects, it's easy to forget the importance of the preheating stage, which can lead to component damage or even destruction. So, why is this crucial step often forgotten when operating in an SMT processing plant? What are the consequences of omitting this stage?
What is preheating before PCBA soldering?
When technicians and practitioners hear the words temperature profile or temperature curve, the first thing that comes to mind is SMT reflow soldering. Along the considerable length of the soldering zone, it's easy to see 4 main temperature control zones, hoping to ultimately form perfect solder joints. Each stage is carefully controlled and improved through the experience and repeated experiments of technicians, and each stage plays a role in promoting solder joint quality and reducing defects. But other industrial soldering machines may not have such fine temperature control. But they all have one thing in common, that is, the preheating stage.
Flux burning in selective wave soldering
The role of the preheating stage is to steadily raise the temperature of the entire component from room temperature to a soaking temperature below the solder paste melting point, approximately 150°C. Adjust the temperature change to maintain a constant change of a few degrees per second. Following the preheating stage is the soaking stage, which maintains this temperature for a period of time to ensure that the board is heated evenly. Then comes the reflow stage, which begins to form solder joints. During the preheating and soaking stages, the volatile solvents in the solder paste are burned off, and the flux is activated.
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