What is the process of SMT patch processing outsourcing cooperation?


More and more SMT factories are now offering turnkey services, allowing customers to avoid the production process and investment in electronic material procurement, warehousing, outsourcing, logistics, and personnel.

More and more SMT chip factories are now offering turnkey services, allowing customers to avoid the production and manufacturing process and avoid investment in electronic material procurement, warehousing, outsourcing, logistics, and personnel.

 

 What is the process of SMT chip processing outsourcing cooperation?

 

The cooperation model of SMT chip processing and packaging materials can effectively save customers time, labor, and storage costs. Only production data and necessary process confirmations need to be provided during the production process. Although the price may be slightly higher than doing it yourself, the overall cost may be more cost-effective. Customers only need to provide complete information (such as PCB files, BOM tables, coordinate files, installation files, etc.), and other production and processing can be handed over to the factory. So, what is the cooperation process of SMT chip processing and packaging materials?


1. SMT chip manufacturability assessment, and the factory quotes based on the information provided by the customer;

2. After business communication, both parties confirm the cooperation and sign the contract.

3. The customer provides the processing materials. After the customer completes the product design, the Gerber files, BOM lists, and other engineering documents are given to the manufacturer. The manufacturer will have specialized process personnel to review and determine, evaluating key points such as stencil printing, chip placement, and plug-in processes.

4. Material procurement, inspection, and after material preparation is complete, production is scheduled according to the PMC plan.

5. SMT chip processing, DIP plug-in processing, online production processing of materials, after processes such as SMT chip placement, reflow soldering, AOI inspection, DIP plug-in, and wave soldering, quality inspection is performed.

6. Quality department inspection. The quality department conducts random inspections of some or all products. If defective products are found, they are repaired.

7. Packaging, transportation, and after-sales service. Packaging and transportation should be carried out after all product production, processing, and quality inspection. The packaging uses anti-static packaging bags. If the customer has special requirements, the packaging will be carried out according to customer needs, and after-sales service will be tracked.

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