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Introduction to chip-related knowledge by domestic chip manufacturers
Semiconductor device manufacturing is the process of making semiconductor devices, typically integrated circuits (ICs), such as computer processors, microcontrollers, and memory chips (e.g., NAND flash and DRAM). It is a multi-step photolithographic and physicochemical process (including steps such as thermal oxidation, thin film deposition, ion implantation, etching, etc.) in which electronic circuits are gradually formed on a wafer, typically made of pure single-crystal semiconductor material. Almost always silicon is used, but various compound semiconductors are also used for specialized applications.
Semiconductor device manufacturing is the process of creating semiconductor devices, typically integrated circuits (ICs), such as computer processors, microcontrollers, and memory chips (e.g., NAND flash and DRAM). This is a multi-step photolithographic and physicochemical process (including steps such as thermal oxidation, thin film deposition, ion implantation, etching, etc.) in which electronic circuits are gradually formed on a wafer, usually made of pure single-crystal semiconductor material. Almost always silicon is used, but various compound semiconductors are also used for specialized applications.
The manufacturing process takes place in highly specialized semiconductor fabrication plants (also known as fabs or "foundries"), the core of which is the "cleanroom." In more advanced semiconductor devices, such as modern 14/10/7 nanometer nodes, the manufacturing process can take up to 15 weeks, with an industry average of 11-13 weeks. Production in advanced manufacturing facilities is fully automated, with automated material handling systems responsible for transporting wafers from one machine to another.
Wafers typically contain multiple integrated circuits, which are referred to as chips because they are cut from a single wafer. Individual chips are separated from the finished wafer in a process called chip separation (also known as wafer dicing). The chips can then undergo further assembly and packaging.
Within the fab, wafers are transported in special sealed plastic boxes called FOUPs. Many fabs have FOUPs with an internal nitrogen atmosphere, which helps prevent oxidation of the copper on the wafers. Copper is used for wiring in modern semiconductors. The interior of the processing equipment and FOUPs is cleaner than the surrounding air in the cleanroom. This internal atmosphere is called a microenvironment and helps improve yield, i.e., the number of working devices on a wafer. This microenvironment is located within the EFEM (Equipment Front End Module), which allows the machine to receive the FOUP and introduce the wafers from the FOUP into the machine. In addition, many machines also process wafers in a clean nitrogen or vacuum environment to reduce contamination and improve process control. The fab requires large amounts of liquid nitrogen to maintain the atmosphere within the production machines and FOUPs and continuously purge with nitrogen. A curtain or mesh may also be installed between the FOUP and EFEM, which helps reduce the amount of moisture entering the FOUP and improves yield.
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