PCBA manufacturing involves a series of processes, including PCB manufacturing, component procurement and inspection, SMT surface mount technology, DIP (dual in-line package) insertion, programming, testing, and aging. Given the numerous steps involved in PCBA processing, quality control at each stage is crucial for producing a high-quality product.

　　 1. PCB Manufacturing

　　After receiving a PCBA order, analyze the Gerber files. Pay attention to the relationship between PCB hole spacing and board load-bearing capacity to prevent bending or breakage. Consider high-frequency signal interference and impedance during routing.

　 　2. Component Procurement and Inspection

　　Component procurement requires strict channel control. Sourcing must be from major distributors and original manufacturers, completely eliminating the use of second-hand or counterfeit materials. A dedicated incoming inspection position is established to rigorously check the following items to ensure component functionality.

　　PCB: Reflow oven temperature testing, checking for flying leads, plugged or missing holes, and board warping.

　　IC: Verify that the silkscreen markings match the BOM (Bill of Materials) exactly and store under constant temperature and humidity; Other common materials: Check silkscreen markings, appearance, and power measurement values. Inspection items are determined by sampling methods, generally at a rate of 1-3%.

　　 3. SMT Surface Mount Technology Processing

　　Solder paste printing and reflow oven temperature control are key. Selecting high-quality laser stencils that meet process requirements is crucial. Depending on the PCB requirements, some stencils may need to be enlarged or reduced, or U-shaped holes may be used according to process requirements. The oven temperature and speed control of the reflow oven are critical to solder paste wetting and weld reliability and can be controlled according to normal SOP operating instructions. Strict AOI (Automated Optical Inspection) testing is also required to minimize the impact of human error.

　 　4. DIP Insertion Processing

　　In the insertion process, the design of the wave soldering mold is key. How to maximize the use of the mold to improve the probability of providing excellent products after the oven is a process that PE engineers must continuously practice and summarize experience.

　　 5. Program Burning

　　In the previous DFM (Design for Manufacturing) report, it is recommended that customers set some test points on the PCB to test the continuity of the PCB and PCBA circuit after all components are soldered. If possible, customers can be asked to provide the program, and the program can be burned into the main control IC through a programmer. This allows for a more intuitive test of the functional changes brought about by various touch actions, thereby testing the completeness of the entire PCBA function.

　 　6. PCBA Board Testing

　　For orders with PCBA testing requirements, the main test contents include ICT (In-Circuit Test), FCT (Functional Circuit Test), aging test, temperature and humidity test, and drop test. These can be performed according to the customer's test plan, and the data can be summarized in a report.

　　PCBA surface mount technology processing consists of multiple assembly processes. The assembly process requirements vary depending on the customer's product type. The PCBA processing process can be roughly divided into SMT surface mount, DIP insertion, PCBA testing, and finished product assembly; these four processes are essential and important.

　 　Printed Circuit Board

　　1. SMT Surface Mount Technology Process Flow

　　In the SMT surface mount process, electronic components are purchased according to the BOM provided by the customer. After confirming the production plan, process documents are issued, and SMT programming, stencil making, material preparation, and online operations begin. The SMT surface mount process flow is: solder paste printing → SPI (Solder Paste Inspection) testing → placement → IPQC (In-Process Quality Control) first-piece inspection → reflow soldering → AOI testing; In the SMT surface mount process, the focus is on controlling the quality of solder paste printing and the temperature of the reflow oven. 70% of SMT surface mount defects come from printing and reflow oven temperature parameters.

　 　2. DIP Insertion Process

　　Due to the precision of electronic products today, there are few plug-in components in PCBA processing (except for power boards), and manual plug-in is generally used. DIP insertion process: component allocation → insertion → IPQC first-piece inspection → fixture installation → wave soldering → lead trimming → rework → cleaning → full appearance inspection; In the DIP insertion process, the orientation of the plug-in components and whether the components are floating during fixture installation should be strictly controlled.

　　 3. PCBA Testing Process

　　PCBA testing is a key quality control link in the entire PCBA processing process. It is necessary to strictly follow the PCBA testing standards and test the test points of the circuit board according to the customer's test plan. There are four main types of PCBA testing: ICT testing, FCT testing, aging testing, and reliability testing.

　　4. Finished Product Assembly Process

　　The finished product assembly process is the process of assembling the PCBA board with its casing intact and undamaged. The finished product surface is free of scratches, and then finished product testing and electrostatic packaging are performed. The finished product assembly process must strictly follow the engineer's product work instructions and procedures; ignoring a single process will increase manufacturing costs.

　　PCBA processing is a multi-stage process. Any problem at any stage will have a significant impact on the overall product quality. Therefore, it is necessary to strictly control the process of each process to avoid the outflow of unqualified products.