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What are the advantages of SMT factories?
SMT, an electronic assembly technology that developed from the 1970s to widespread application in the 1990s, saw relatively slow initial development due to its multidisciplinary nature. However, with the coordinated development of various disciplines, SMT experienced rapid growth and popularization in the 1990s. By the 21st century, SMT had become the mainstream technology in electronic assembly.
SMT stands for Surface Mount Technology, a mounting technique that directly solders components onto the surface of a PCB at designated locations without the need for through-hole drilling. So, what are the advantages of SMT assembly processing? Let's explore!
Characteristics of SMT Assembly Processing
From the definition above, we know that SMT evolved from traditional through-hole insertion technology (THT), but it differs from traditional THT. So, what are the advantages of SMT over THT? Here are its prominent advantages:
1. High assembly density, small electronic product size, and light weight. The volume and weight of surface mount components are only about one-tenth that of traditional plug-in components. Generally, after using SMT, the volume of electronic products can be reduced by 40%~60%, and the weight can be reduced by 60%~80%.
2. High reliability, strong vibration resistance, and low solder joint defect rate.
3. Good high-frequency characteristics. Reduces electromagnetic and radio frequency interference.
4. Easy to automate, improving production efficiency.
5. Cost reduction of 30%~50%. Saves materials, energy, equipment, manpower, and time.
Using Surface Mount Technology (SMT) is a trend in the electronics industry
Knowing the advantages of SMT, we should utilize these advantages to serve us. Moreover, with the miniaturization of electronic products, THT can no longer meet the requirements of product processes. Therefore, SMT is the development trend of electronic assembly technology.
Its performance is:
1. The pursuit of miniaturization in electronic products means that previously used through-hole plug-in components can no longer meet the requirements.
2. Electronic products have more complete functions. The integrated circuits (ICs) used, due to their powerful functions and numerous pins, can no longer be made into traditional through-hole components, especially large-scale, highly integrated ICs, which must use surface mount component packaging.
3. With the mass production and automation of production, factories must produce high-quality products at low cost and high output to meet customer needs and strengthen market competitiveness.
4. The development of electronic components, integrated circuits (ICs), and the diverse applications of semiconductor materials.
5. Performance of electronic products, higher assembly precision requirements.
6. The electronic technology revolution is imperative, pursuing international trends.
SMT-Related Components and Technology
SMT, an electronic assembly technology that developed from the 1970s to widespread application in the 1990s, developed relatively slowly in its early stages due to its involvement in multiple disciplines. With the coordinated development of various disciplines, SMT rapidly developed and became widespread in the 1990s. After entering the 21st century, SMT has become the mainstream of electronic assembly technology.
The following are the disciplines and technologies related to SMT:
1. Electronic component and integrated circuit design and manufacturing technology
2. Electronic product circuit design technology
3. Printed circuit board manufacturing technology
4. Automatic placement equipment design and manufacturing technology
5. Circuit assembly manufacturing process technology
6. Auxiliary material development for assembly manufacturing and PCB production technology
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