People's desire for innovation and the relentless demand for more powerful and compact electronic devices continue to drive the growth and development of the printed circuit board (PCB) industry and contract electronics manufacturing (CEM).

　　In this blog post, we will explore the PCB industry trends, advancements, and technologies that are revolutionizing electronics and CEM.

　　 Contract Electronics Manufacturing Partnerships

　　Contract electronics manufacturing, the practice of outsourcing the production of electronic components and assemblies, allows original equipment manufacturers (OEMs) to focus on their core competencies, which include developing and marketing new electronic products and technologies.

　　A key advancement in the CEM field is the rise of partnerships, where CEM providers work closely with OEMs during the design and development phases. The benefits of this collaboration are more efficient production processes, improved quality control, and ultimately, faster time-to-market for the final electronic product.

　　In full assembly or turnkey manufacturing, the CEM assembles the entire electronic system or product, further streamlining the manufacturing process by reducing the number of suppliers, thus reducing potential points of failure, and again relieving the OEM of another operational process burden.

　 　New Trends in PCB Assembly Technology

　　Surface Mount Technology (SMT)

　　SMT is transforming PCB assembly. SMT is an automated assembly process that uses automated production lines to paste and solder components onto circuit boards. This allows for smaller, denser components to be placed on the PCB, resulting in more compact and efficient electronic devices. Miniaturization (see below) and component density are key aspects of modern PCB design.

　　 Advanced Robotics

　　Advanced robotics also plays a significant role in improving the efficiency of PCB assembly. Robotic arms and automated pick-and-place machines ensure precision and consistency, minimizing human error and wasted rework time. These advancements speed up the assembly process and contribute to improved product quality and reliability.

　　 Virtual and Augmented Reality

　　VR and AR will also positively impact how assembly teams are trained, allowing them to learn how to assemble new PCB designs, as well as how to perform quality testing, disassembly, and maintenance and repair.

　 　Advanced Technologies and Materials Powering PCB Manufacturing

　　High-Density Interconnect (Miniaturization)

　　As the demand for smaller and more powerful electronic devices continues to grow, PCBs must be designed to accommodate more components in a smaller space. The development of high-density interconnect (HDI) technology allows PCBs to achieve miniaturization through complex multilayer boards and "fine-pitch" components (i.e., boards with a significantly increased number of components per square inch). HDI technology is used in innovations across a range of industries, from wearable technology such as smartwatches to complex medical devices.

　 　Artificial Intelligence (AI)

　　Artificial intelligence has made its mark in numerous industries, including PCB manufacturing, where machine learning algorithms are used to improve quality control and identify defects in the production process. AI-powered optical inspection systems can detect even the smallest defects, resulting in an overall improvement in the quality of PCB assemblies.

　　AI can also be used in the design phase, helping engineers optimize PCB component placement for better performance, heat dissipation, and signal integrity—essential applications for electronic devices following the proliferation of the Internet of Things (IoT) and the introduction of 5G technology. AI can also enable faster and more accurate prototyping, ultimately shortening the time to market for new products.

　　 Additive Manufacturing (3D Printing of PCBs)

　　Additive manufacturing, the process of joining materials together layer by layer to create an object based on 3D model data (commonly known as 3D printing), is an alternative method for PCB prototyping and small-scale production. 3D-printed PCBs can be highly customized and used to shorten lead times. While additive manufacturing is not yet suitable for mass production, it promises to play a significant role in PCB development and faster prototyping compared to subtractive manufacturing (i.e., removing material by grinding, cutting, or drilling).

　 　Advanced Materials

　　A growing number of modern electronic devices require the use of materials with different properties than traditional materials for manufacturing PCBs to meet specific functional and characteristic needs.

　　Ceramic substrates or base layers offer better thermal conductivity, improving PCB performance by transferring and dissipating heat from hotspots across the surface. This characteristic makes ceramic PCBs essential materials for industries such as aerospace, automotive, medical devices, heavy machinery, and electronics.

　　High-frequency laminates with a stable dielectric constant (i.e., the ability to store electrical energy) reduce signal loss and improve reliability, making PCBs manufactured with this material ideal for the defense and medical industries.

　　Flexible substrates, flexible and rigid-flex PCBs (i.e., boards consisting of multiple layers of flexible circuit substrates/layers connected to one or more rigid boards) are suitable for applications that require the PCB to bend or flex to accommodate unusual shapes or sizes and reliably operate in high-temperature environments. Due to their space-saving characteristics, flexible PCBs are well-suited for use in electronic devices such as smartphones, tablets, cameras, printers, and laptops. Flexible PCBs are also fundamental components of pacemakers, cochlear implants, and defibrillators.

　　Biodegradable polymers can be used as a substitute for the currently used toxic thermosetting resins in PCB manufacturing. However, these biodegradable substrate materials cannot withstand subtractive processes such as etching and chemical cleaning.

　　 Learn how MPE integrates ceramic substrates into its PCB manufacturing

　　 Case Study: MPE assembles wet labels with ceramic plates for a global tire manufacturer

　　Future Challenges

　　Security and Certification

　　As IoT devices remain constantly connected within their networks, they are constantly vulnerable to potential data theft and cyberattacks. Electronics manufacturers need to partner with PCB manufacturers who can adapt to these challenges, ensuring their security during installation and arranging for automatic software updates to defend against attacks.

　　Furthermore, the requirement for adaptation to regulations and IoT governance requires connected electronics manufacturers to be responsible for staying abreast of ever-changing rules and obtaining various certifications.

　 　Overcoming Rising Costs

　　Rising costs, material supply disruptions, complex assembly procedures, and labor have been a major concern for OEMs. One solution popular in the aerospace industry is the use of Commercial Off-The-Shelf (COTS) solutions, components designed for easy installation into existing systems. This can reduce costs, ensure quality and safety, and accelerate project completion.

　　What impact might these trends have on your products?

　　The outlook for the PCB industry will continue to be shaped by the demands of an increasingly interconnected and technology-driven world. Trends such as CEM partnerships and full-turnkey assembly services, as well as advancements in the technologies and materials used in PCB manufacturing and assembly, will determine the near-term future of your products in terms of efficiency, reliability, and sustainability.