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SMT processing manufacturer: What should be paid attention to during SMT patch repair?
SMT manufacturers say that SMT is an abbreviation for a series of processes based on SMT. Generally, the electronic products we use are made by combining SMT with capacitors, resistors, and other electronic components according to a designed circuit diagram. Therefore, various electrical appliances require different SMT chip processing technologies. SMT manufacturers say that the following points should be noted during the repair of high-precision SMT patches:
SMT processing manufacturer It says that SMT refers to the abbreviation of a series of processes based on SMT. Generally, the electronic products we use are designed according to the designed circuit diagram by adding capacitors, resistors and other electronic components to SMT. Therefore, various electrical appliances require different SMT chip processing technologies. The SMT processing manufacturer says that the following points should be noted during the repair of high-precision SMT patches:
Manual soldering should follow the principle of small to large, low to high. Soldering should be carried out in batches, first soldering chip resistors, chip capacitors, transistors, then soldering small and large IC devices, and finally soldering inserts.
When soldering chip components, the width of the soldering head should be consistent with the width of the component. If it is too small, it will be difficult to locate during assembly and soldering.
When soldering SOP, QFP, PLCC and other double-sided or four-sided devices with pins, several positioning points should be welded on the double-sided or four-sided. After carefully checking and confirming that each pin is consistent with the corresponding pad, drag soldering can be carried out to complete the soldering of the remaining pins. Do not drag the soldering speed too fast, about 1 second for one solder point.
After soldering, use a magnifying glass to check 4-6 times whether there is any bridging between the solder joints. In places with bridging, use a brush to dip a little flux, and then drag and solder again. The same part should not be soldered continuously for more than 2 times. If it is not finished at once, it should be cooled before soldering again.
When soldering IC devices, applying a uniform layer of solder paste on the pads can not only wet and solder the solder joints, but also greatly facilitate the maintenance work and improve the maintenance speed.
SMT processing manufacturer It says that the temperature and humidity management of the SMT patch processing workshop has strict requirements, mainly to ensure the quality of SMT welding and improve the production efficiency of SMT patch processing. A suitable temperature and humidity workshop environment is one of the important factors to ensure the quality of SMT welding. If the workshop environmental conditions are not well controlled, the electronic product components and welding effects may be damaged, and the entire SMT circuit will be damaged. The following is an introduction to the SMT processing manufacturer:
High humidity in the manufacturing environment can lead to many serious problems, such as excessive moisture absorption by the solder paste, which can easily lead to bridging, short circuits, solder balls and bubbles (especially BGA solder joints) during reflow soldering. The flux in the solder paste volatilizes too quickly, causing the solder paste to dry out. During the printing process, it is easy to cause omissions, lack of tin, and sharp points. Too high temperature may lead to partial oxidation of the solder paste, volatilization of the flux, and even affect the welding effect of SMT.
Non-standard temperature and humidity have a great impact on the quality of the entire SMT chip manufacturing. Therefore, we must control the temperature and humidity of the SMT chip processing workshop. For how to control, you can contact our SMT processing manufacturer. We have many years of experience in this industry.
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