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Eight Common Methods for PCBA Testing
With the miniaturization of electronic products, there are about eight methods for assembling components on circuit boards in the production process. These can be divided into: manual visual inspection, digital microscope, SPI solder paste inspection machine, automated optical inspection (AOI), SMT first-piece inspection instrument, in-line testing, functional testing (FCT), and automatic X-ray inspection. Now, let's briefly introduce the main PCBA testing technologies.
With the miniaturization of electronic products, there are about eight methods for assembling components on circuit boards during production, which can be divided into: manual visual inspection, digital microscope, SPI solder paste inspection machine, automatic optical inspection (AOI), SMT first-piece inspection instrument, online testing, functional testing (FCT), and automatic X-ray inspection. Now, let's briefly introduce the main PCBA testing technologies.
SPI solder paste inspection machine used for PCBA testing
The SPI solder paste inspection machine uses optical principles to calculate the height of the solder paste printed on the PCB through triangulation. Its function is to detect and analyze the solder paste printing quality, find SMT process defects in advance, allow users to monitor production problems in real time, reduce defects caused by poor solder paste printing, provide strong quality control support for operators, and improve process efficiency.
Manual visual inspection for PCBA testing
Manual visual inspection for PCBA testing refers to using the human eye, with or without magnifying glass illumination, to visually inspect the printed circuit board and solder joints for quality problems such as appearance, missing parts, wrong parts, polarity reversal, and deviations.
Digital microscope used for PCBA testing
A digital microscope converts the real image seen under the microscope into a digital signal, magnifying and displaying the real image on a computer screen. It can save and print images and use measurement software to measure various data. Applications: Suitable for testing on electronic industry production lines, testing printed circuit boards, and testing welding defects of printed circuit components.
SMT first-piece inspection instrument used for PCBA testing
The SMT first-piece inspection instrument integrates CAD coordinates, BOM tables, and PCB first-piece scan images to automatically input measurement data, simplifying SMT production line product inspection. LCR reading data automatically corresponds to the corresponding position. The test results are judged from west to east to prevent testing errors and omissions. A test report is automatically generated and stored in the database.
Automatic optical inspection for PCBA testing
Automatic optical inspection (AOI) is a new technology that uses optical and digital imaging technology, as well as computer and software technology, to analyze images and perform automatic detection. AOI automatically scans the printed circuit board with a camera, collects images, compares the detected solder joints with the qualified parameters in the database, detects defects on the PCB through image processing, such as missing parts, wrong parts, bad parts, solder balls, offsets, component tilt, reversed installation, inverted pins, bridging, cold solder joints, missing solder, insufficient or excessive solder, floating components, bent IC leads, etc., and marks the defects on the display or automatically marks them, providing correction instructions for maintenance personnel.
X-ray inspection for PCBA testing
Automatic X-ray inspection is a new technology that uses X-rays to penetrate materials and discover internal defects through attenuation characteristics. It mainly detects internal defects in solder joints, such as BGA, CSP, and FC chip solder joints. X-rays can penetrate the surface of an object to directly see the internal structure of the solder joint being inspected. It can be used to detect and analyze various common welding quality defects of electronic components. X-ray inspection can comprehensively reflect the welding quality of solder joints, including open circuits, short circuits, holes, bubbles, solder content, etc., and can achieve quantitative analysis. A major feature of X-ray inspection is that it can detect solder joint defects under BGA packaged components, such as bridging, open circuits, missing solder balls, displacement, insufficient pin material of the inspected object, voids, and blurred edges of solder joints.
Online testing for PCBA testing
Online testing is a standard testing method that checks for manufacturing defects and bad components by testing the electrical performance and connection of online components. A dedicated needle bed contacts the solder joints of components on the assembled circuit board and performs discrete isolation testing using a few hundred millivolts of voltage and a current less than 10 mA to accurately measure the missing solder, parameter value deviations, solder joint bridging, open circuits or short circuits on the circuit board, etc.
Functional testing for PCBA testing
Functional testing for PCBA testing provides a simulated operating environment to test the circuit board, allowing the circuit board to operate under design conditions to obtain output and verify the functional status of the circuit board. Simply put, it means connecting the assembled electronic device's dedicated circuit board to the corresponding circuit of the device, then applying voltage. If the device works normally, the circuit board is considered qualified.
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