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Introduction to the basic process of SMT surface mount processing
Today, SMT surface mount technology is increasingly used in the electronics industry. In order to achieve miniaturization, thinner, lighter, and more functional electronic products, the requirements for circuit board design are becoming increasingly stringent, and the technical requirements are also becoming increasingly higher.
Today, SMT surface mount processing technology is increasingly widely used in the electronics industry. In order to achieve miniaturization, thinness, lightness, and more functions of electronic products, the requirements for circuit board design are becoming increasingly stringent, and the technical requirements are also becoming increasingly high.
Today, SMT surface mount processing technology is increasingly widely used in the electronics industry. In order to achieve miniaturization, thinness, lightness, and more functions of electronic products, the requirements for circuit board design are becoming increasingly stringent, and the technical requirements are also becoming increasingly high. Strict processing technology is required. Today, Tongsen Electronic will introduce the SMT surface mount processing process.
1. First of all, before SMT surface mount processing, a detailed surface mount location diagram is required. Our Xing'en Yu Electronics customers need to provide samples, and design, develop, and compile relevant programs based on the provided samples.
2. Before soldering electronic components, solder paste is applied to the pads using a stencil. These all require screen printing machine processing.
3. In SMT surface mount processing, in order to fix the electronic components on the PCB and prevent them from loosening, glue must be applied to the fixed positions on the PCB board.
4. Then, the surface mount machine is used to install the electronic components to be assembled on the PCB according to the positions on the drawing.
5. Melt the surface mount glue on the PCB to make the PCB board and the assembled electronic components adhere better together, and prevent them from falling off due to touching and shaking.
6. After SMT surface mount processing and soldering, a large amount of residue will remain on the PCB board, which is harmful to the human body and affects the quality of the PCB. Therefore, it is necessary to clean them and use flux remover to clean them.
7. After completion, it is also necessary to check whether the assembly position is accurate, the quality after assembly, and whether it is qualified. The detection needs to be carried out with the aid of magnifying glasses, microscopes, functional testers, and other related measuring tools.
8. If faults are found after SMT surface mount processing and detection, rework, reassembly, and position checking are also required.
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