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What is SMT (Surface Mount Technology)?
Surface Mount Technology (SMT) is one of the prevalent technologies and processes in the electronics assembly industry. Surface mount component (SMC) technology is a surface mounting or installation method of mounting leadless or short-leaded surface mount components (SMC, also known as SMD, surface mount device) onto the surface of a printed circuit board (PCB) or other substrate. This is a circuit mounting technology that uses reflow soldering or dip soldering to solder the components.
Surface Mount Technology (SMT) is one of the prevalent technologies and processes in the electronics assembly industry. Surface mount component (SMC) technology is a surface mounting or mounting method of mounting leadless or short-lead surface mount components (SMC, also known as SMD, surface mount devices) onto the surface of a printed circuit board (PCB) or other substrate. This is a circuit mounting technology that uses reflow soldering or dip soldering to solder the components.
What is the basic process of SMT?
The basic process of SMT is as follows: Screen printing takes precedence, which will allow for subsequent dispensing, mounting, reflow soldering, cleaning, SPI, inspection, and defect rework.
Screen Printing: Preparation work for component soldering, printing solder paste or film onto the PCB pads. It requires a screen printer (screen printing machine) located at the front end of the SMT production line.
Dispensing: Dispensing adhesive at fixed positions on the PCB. The main purpose of the adhesive is to secure the components to the PCB. It requires a dispenser located at the front end of the SMT production line or after the inspection equipment.
Mounting: This is to precisely mount the surface mount components at fixed positions on the PCB. It requires a machine installed behind the screen printer on the production line.
Reflow Soldering: In this process, the solder paste is melted, allowing the surface mount components to be firmly bonded to the PCB. It requires a curing furnace located behind the mounting machine in the production line.
Cleaning: In this process, harmful soldering residues such as flux are removed from the assembled PCB. It requires a cleaning machine, whose location may vary, either within or outside the production line.
Solder Paste Inspection (SPI): In this process, the defects in solder paste printing such as volume, area, height, offset, defects, damage, height deviation, etc. are detected.
Inspection: This process reviews the soldering quality and assembly quality of the assembled PCB. It requires magnifiers, microscopes, in-circuit testers (ICT), flying probe testers (FPT), automated optical inspection (AOI), X-ray inspection systems, functional testers, etc., which can be allocated at appropriate positions on the production line according to inspection requirements.
Rework: After inspection, rework is performed on the printed circuit boards that have been detected as faulty. The necessary tools are soldering irons, rework stations, etc., which can be allocated at any position on the production line.
According to the location of the assembled components, it can be divided into two types: single-sided and double-sided.
Single-sided production process
PCB placement → Laser engraving SN → Solder paste with screen printing applied → SPI → Mounting → AOI → Reflow soldering → Board cutting → Inspection → Defect rework
Double-sided production process
PCB placement → Laser engraving SN → Solder paste with screen printing applied on side A → SPI → Mounting → AOI → Reflow soldering on side A → Flip board → Solder paste with screen printing applied on side B → SPI → Mounting → AOI → Reflow soldering → Board cutting → Inspection → Defect rework
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