Welcome to Guangzhou Tongsen Electronic Technology Co., LTD. Website!

TEL:

020-82167030

OEM :

136-3210-0256

PROCESSING:

150-1879-2052

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DFM inspection

Check the items of customer's design PCB, BOM, schematic diagram, finished product assembly manual:
• Document version and last update time
• Process: lead/lead -free
• Clear component tag number and silk screen
• Including manufacturer's brand and part number, BOM of description and bit number
• Confirm the PCB manufacturing process: material, board thickness, copper thickness, number of layers, surface treatment, character color and special process
• Reasonable PCB layers and paneling methods
• Provide correct SMT patch files
• Complete program programming and functional testing solutions
• Clear finished product assembly manual and schematic diagram
• Other special process requirements

MORE BUSINESS

Component Storage and Solder Paste Printing

Sensitive components are stored in a professional constant temperature and humidity box Bake some demanding PCB/IC/BGA for 2-12 hours to remove surface moisture and enhance solderability Use first-line brand solder paste Issuing high-quality laser stencils Complete solder paste freezing, thawing and stirring procedures Equipped with a fully automatic solder paste printing machine to ensure the consistency and reliability of solder paste printing during mass production

IQC incoming inspection

Procurement of electronic components

New product introduction meeting

WeChat

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136 3210 0256

(Telephone contact)

OEM: 136-3210-0256

Processing： 150-1879-2052

Email:

810052158@qq.com

Address： 4th Floor, Building J, Jitang Industrial Park, No. 8, South Yunwu Road, Science City, Huangpu District, Guangzhou

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