Welcome to Guangzhou Tongsen Electronic Technology Co., LTD. Website!

TEL:

020-82167030

OEM :

136-3210-0256

PROCESSING:

150-1879-2052

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IQC incoming inspection

•Measuring the thickness of a PCB
•Check the through holes of the PCB and whether the ink is blocking the holes, etc.
•Check whether the PCB is warped and deformed, and whether the silk screen is clear
•Check the PCB for defects such as broken wires, jumpers, etc.
•Place the PCB in reflow soldering for oven temperature test to check for yellowing or deformation
•Check whether the batch number, part number and silk screen of incoming electronic components are consistent with the BOM
•Incoming electronic components are placed on the bare PCB board for pad or through-hole adaptation testing
•Sampling check the resistance, capacitance, etc. of incoming electronic components, and compare with BOM
•Check the surface of incoming electronic components for scratches, deformation, broken feet, short feet, etc.

Component Storage and Solder Paste Printing

Procurement of electronic components

Component Storage and Solder Paste Printing

Procurement of electronic components

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Component Storage and Solder Paste Printing

Sensitive components are stored in a professional constant temperature and humidity box Bake some demanding PCB/IC/BGA for 2-12 hours to remove surface moisture and enhance solderability Use first-line brand solder paste Issuing high-quality laser stencils Complete solder paste freezing, thawing and stirring procedures Equipped with a fully automatic solder paste printing machine to ensure the consistency and reliability of solder paste printing during mass production

IQC incoming inspection

Procurement of electronic components

New product introduction meeting

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136 3210 0256

(Telephone contact)

OEM: 136-3210-0256

Processing： 150-1879-2052

Email:

810052158@qq.com

Address： 4th Floor, Building J, Jitang Industrial Park, No. 8, South Yunwu Road, Science City, Huangpu District, Guangzhou

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Power:www.30.0.cn

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